Title of article :
Effect of stress ratio on fatigue crack growth in TiAl intermetallics at room and elevated temperatures
Author/Authors :
Zhu، نويسنده , , S.J. and Peng، نويسنده , , L.M and Moriya، نويسنده , , T and Mutoh، نويسنده , , Y، نويسنده ,
Pages :
9
From page :
198
To page :
206
Abstract :
The fatigue crack growth behavior of γ-based titanium aluminides (TiAl) with a fine duplex structure and lamellar structure has been investigated by scanning electron microscope (SEM) in situ observation in vacuum at 750°C and room temperature. For the duplex structured material the fatigue crack growth rates are dominated by the maximum stress intensity, particularly at 750°C. The threshold stress intensity range for fatigue crack growth at 750°C is lower than that at room temperature for any corresponding stress ratio. The fatigue crack growth rate at 750°C is affected by creep deformation in front of the crack tip. The severe crack blunting occurs when the stress ratio is 0.5. For the lamellar structured material the scatter of fatigue crack growth data is very large. Small cracks propagate at the stress intensity range below the threshold for long fatigue crack growth. The effects of microstructure on fatigue crack growth are discussed.
Keywords :
stress ratio , Fatigue crack growth , TiAl intermetallics , Temperature
Journal title :
Astroparticle Physics
Record number :
2056919
Link To Document :
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