• Title of article

    Effect of stress ratio on fatigue crack growth in TiAl intermetallics at room and elevated temperatures

  • Author/Authors

    Zhu، نويسنده , , S.J. and Peng، نويسنده , , L.M and Moriya، نويسنده , , T and Mutoh، نويسنده , , Y، نويسنده ,

  • Pages
    9
  • From page
    198
  • To page
    206
  • Abstract
    The fatigue crack growth behavior of γ-based titanium aluminides (TiAl) with a fine duplex structure and lamellar structure has been investigated by scanning electron microscope (SEM) in situ observation in vacuum at 750°C and room temperature. For the duplex structured material the fatigue crack growth rates are dominated by the maximum stress intensity, particularly at 750°C. The threshold stress intensity range for fatigue crack growth at 750°C is lower than that at room temperature for any corresponding stress ratio. The fatigue crack growth rate at 750°C is affected by creep deformation in front of the crack tip. The severe crack blunting occurs when the stress ratio is 0.5. For the lamellar structured material the scatter of fatigue crack growth data is very large. Small cracks propagate at the stress intensity range below the threshold for long fatigue crack growth. The effects of microstructure on fatigue crack growth are discussed.
  • Keywords
    stress ratio , Fatigue crack growth , TiAl intermetallics , Temperature
  • Journal title
    Astroparticle Physics
  • Record number

    2056919