Author/Authors :
Yan، نويسنده , , J and Yoshino، نويسنده , , M and Kuriagawa، نويسنده , , T and Shirakashi، نويسنده , , T and Syoji، نويسنده , , K and Komanduri، نويسنده , , R، نويسنده ,
Abstract :
The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (−40°) and a high side cutting edge angle (SCEA) (∼88°) and undeformed chip thickness in the nanometric range (∼50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (∼400 MPa) apparatus.
Keywords :
Ductile machining , Ultra-precision machining , hydrostatic pressure , Silicon
