Laser induced deposition of tungsten and copper

We present recent results obtained in our laboratory on the laser processing for deposition of tungsten and copper. Four processes are presented. (1) An Ar+ laser or a diode laser are used in a direct writing mode to produce W and WSix lines from WF6 reduced by H2 and/or SiH4, and deposited on silicon, TiN, SiOxNy and polyimide. (2) Pure α-W films were also deposited on GaAs by KrF excimer laser-induced deposition using a WF6/SiH4/H2 gas mixture. (3) Very uniform, shiny metallic copper films, with Cu/C ratios up to 17 were deposited on TiN and fluoropolymer substrates by the KrF excimer laser-assisted decomposition of Cu(hfac)(TMVS). (4) Finally, we have studied the Ar+ and diode laser direct writing of Pd and Au for the selective activation of the electroless plating of Cu.