A novel method for the subdivision of ITO glass substrates

Subdivision of indium tin oxide (ITO) covered glass substrates can be easily carried out by a localized destruction of the ITO under a tungsten needle, applying a voltage between the ITO and the needle tip. The necessary equipment can be set up with commercially available components. The scorched lines almost completely insulate the different segments from each other. Using this method almost, every pattern can be printed into the ITO layer by a computer aided design (CAD) software in combination with a flatbed plotter, by application of a template or by free hand treatment.