Preparation of poly (hydroxymethyl EDOT)/nano-silver composite films by oxidative polymerization with low-baking temperature, low resistance and good adhesion on PET substrate

Low-resistance films were prepared by polymerization of hydroxymethyl EDOT along with nano-Ag at low-baking temperature (below 120 °C) and low-silver contents (below 20 wt%) on PET substrate. The poly (hydroxymethyl EDOT)/nano-Ag composite films showed low resistance at 21 Ω/□ by spin-coating and at 196 m Ω/□ by drop-casting. We also compared the conductive inks of EDOT, AI4083, nano-Ag and hydroxymethyl EDOT/nano-Ag, and investigated their conductivity, film-forming property and adhesion property. The viscosity of hydroxymethyl EDOT/nano-Ag conductive ink was 12.2 cP at 25.9 °C and suitable for application in flexible plastic devices and inkjet printing technology.