Electroplating formation of Al–C covalent bonds on multiwalled carbon nanotubes

We focus on the formation of strong aluminum (Al)–carbon nanotube (CNT) covalent bonds on the CNT walls without deteriorating CNTs for mechanically strong composite. We propose a simple electroplating method to realize Al–CNT covalent bonds on the CNT wall. The CNT electrode was formed on the Cu collector as a cathode and separated from the anode by an organic separator in tetrahydrofuran (THF) under Ar atmosphere. The Al deposition started to increase rapidly at above Al reduction potential. The formation of Al–C covalent bonds was confirmed by X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). Charge transfer from CNTs to Al and generation of D-bands in Raman spectroscopy further confirmed the formation of Al–C covalent bonds.