New developments in MEMS using SiC and TiNi shape memory alloy materials

Developments in microelectromechanical systems using SiC and TiNi shape memory alloy materials have been made between 1995 and 1997. Major advancements were made in the deposition of 3C-SiC on large-area substrates, the development of a SiC-based surface micromachining process, developments of SiC on insulator technologies, materials properties studies of both SiC and TiNi shape memory materials, and the fabrication of SiC and TiNi shape memory alloy-based micromechanical devices.