Thermal decomposition kinetics of a commercial fluoropolymer

Thermal decomposition kinetics of a fluoropolymer (Tefzel) in the temperature range 359–550 °C by thermogravimetry (TG) and 235–270 °C by differential scanning calorimetry (DSC) was investigated under nitrogen flux. The temperature range studied (225–550 °C) includes the range of recommended continuous use and processing temperature of these commercial resins. The activation energy (ΔE) for decomposition was 53.33 k.cal mole−1 in TG at 10 °C/min rate, whereas it was 9.49 k.cal mole−1 in DSC. The effect of heating rate on TG and DSC thermograms was studied.