Title of article
Atomistic study of interaction zone at copper–carbon interfaces
Author/Authors
Dorfman، نويسنده , , Simon and Mundim، نويسنده , , Kleber C. and Fuks، نويسنده , , David and Berner، نويسنده , , Alex and Ellis، نويسنده , , Donald E and Van Humbeeck، نويسنده , , Jan، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2001
Pages
3
From page
191
To page
193
Abstract
Formation of Cu–C composite is a difficult technological problem: carbon is practically insoluble in copper. We show that the heat treatment of the Cu–C composite leads to the formation of thin (approximately 50 nm) interface, which provides the bonding between fiber and matrix. The high-resolution scanning electron microscopy (HR SEM) study displays the formation of the interaction zone. Monte Carlo simulations with repulsive Cu–C interatomic potentials study this zone on the interface.
Keywords
CU , Interatomic potentials , solid solutions , C , Composite
Journal title
Materials Science and Engineering C
Serial Year
2001
Journal title
Materials Science and Engineering C
Record number
2097355
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