Title of article :
Atomistic study of interaction zone at copper–carbon interfaces
Author/Authors :
Dorfman، نويسنده , , Simon and Mundim، نويسنده , , Kleber C. and Fuks، نويسنده , , David and Berner، نويسنده , , Alex and Ellis، نويسنده , , Donald E and Van Humbeeck، نويسنده , , Jan، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2001
Abstract :
Formation of Cu–C composite is a difficult technological problem: carbon is practically insoluble in copper. We show that the heat treatment of the Cu–C composite leads to the formation of thin (approximately 50 nm) interface, which provides the bonding between fiber and matrix. The high-resolution scanning electron microscopy (HR SEM) study displays the formation of the interaction zone. Monte Carlo simulations with repulsive Cu–C interatomic potentials study this zone on the interface.
Keywords :
CU , Interatomic potentials , solid solutions , C , Composite
Journal title :
Materials Science and Engineering C
Journal title :
Materials Science and Engineering C