• Title of article

    Atomistic study of interaction zone at copper–carbon interfaces

  • Author/Authors

    Dorfman، نويسنده , , Simon and Mundim، نويسنده , , Kleber C. and Fuks، نويسنده , , David and Berner، نويسنده , , Alex and Ellis، نويسنده , , Donald E and Van Humbeeck، نويسنده , , Jan، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2001
  • Pages
    3
  • From page
    191
  • To page
    193
  • Abstract
    Formation of Cu–C composite is a difficult technological problem: carbon is practically insoluble in copper. We show that the heat treatment of the Cu–C composite leads to the formation of thin (approximately 50 nm) interface, which provides the bonding between fiber and matrix. The high-resolution scanning electron microscopy (HR SEM) study displays the formation of the interaction zone. Monte Carlo simulations with repulsive Cu–C interatomic potentials study this zone on the interface.
  • Keywords
    CU , Interatomic potentials , solid solutions , C , Composite
  • Journal title
    Materials Science and Engineering C
  • Serial Year
    2001
  • Journal title
    Materials Science and Engineering C
  • Record number

    2097355