Title of article :
The fractal study of Cu–Ni layer accumulation during electrodeposition under diffusion-controlled condition
Author/Authors :
Nouri، نويسنده , , E. and Dolati، نويسنده , , A.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Pages :
8
From page :
1769
To page :
1776
Abstract :
The fractal study of thin layer films has been concerned by numerous studies, but it is a novel idea to use this method for interpretation of layer formation during electrocrystallization, simultaneously. In present study, Scharifkerʹs equations were derived for instantaneous and progressive nucleation and 3D growth of hemispherical centers under diffusion-controlled condition to calculate in situ change of fractal dimension of surface. It was assumed that the layer could be formed completely when fractal dimension of surface inclined to 2. Moreover, the fractal analysis of AFM images has confirmed the presumed model.
Keywords :
A. Thin films , A. Metals , B. Crystal growth , C. Atomic force microscopy , C. electrochemical measurements
Journal title :
Materials Research Bulletin
Serial Year :
2007
Journal title :
Materials Research Bulletin
Record number :
2098453
Link To Document :
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