Use of ultra-thin organic silane films for the improvement of gold adhesion to the silicon dioxide wafers for (bio)sensor applications

A mono-functional silane reagent, 3-mercaptopropyltrimethoxysilane (MPS) was used to modify the surface of silicon wafers. The structure of the SAMs formed with the MPS was investigated by contact angle measurements, ellipsometry, AFM, and X-ray photoelectron spectroscopy (XPS). The deposition of a metallic gold layer via ultra-high vacuum (UHV) evaporation reveals good adhesion properties on Au/MPS/SiO2/Si structure. The “chemisorption” between the SAM and the gold evaporated layer is confirmed by adhesion tests and optimum curing treatment is found 1 h at 100 °C). This very simple methodology, avoiding the usage of Cr and other metals as undercoating layers and could be proposed further for (bio)sensors applications.