• Title of article

    Diamond-like carbon (DLC) thin film bioelectrodes: Effect of thermal post-treatments and the use of Ti adhesion layer

  • Author/Authors

    Laurila، نويسنده , , Tomi and Rautiainen، نويسنده , , Antti and Sintonen، نويسنده , , Sakari and Jiang، نويسنده , , Hua and Kaivosoja، نويسنده , , Emilia and Koskinen، نويسنده , , Jari، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2014
  • Pages
    9
  • From page
    446
  • To page
    454
  • Abstract
    The effect of thermal post-treatments and the use of Ti adhesion layer on the performance of thin film diamond like carbon bioelectrodes (DLC) have been investigated in this work. The following results were obtained: (i) The microstructure of the DLC layer after the deposition was amorphous and thermal annealing had no marked effect on the structure, (ii) formation of oxygen containing SiOx and Ti[O,C] layers were detected at the Si/Ti and Ti/DLC interfaces with the help of transmission electron microscope (TEM), (iii) thermal post-treatments increased the polar fraction of the surface energy, (iv) cyclic voltammetry (CV) measurements showed that the DLC films had wide water windows and were stable in contact with dilute sulphuric acid and phosphate buffered saline (PBS) solutions, (v) use of Ti interlayer between Pt(Ir) microwire and DLC layer was crucial for the electrodes to survive the electrochemical measurements without the loss of adhesion of the DLC layer, (vi) DLC electrodes with small exposed Pt areas were an order of magnitude more sensitive towards dopamine than Pt electrodes and (vii) thermal post-treatments did not markedly change the electrochemical behavior of the electrodes despite the significant increase in the polar nature of the surfaces. It can be concluded that thin DLC bioelectrodes are stable under physiological conditions and can detect dopamine in micro molar range, but their sensitivity must be further improved.
  • Keywords
    Bioelectrochemistry , Diamond-like carbon , Thin solid films , Neurotransmitters
  • Journal title
    Materials Science and Engineering C
  • Serial Year
    2014
  • Journal title
    Materials Science and Engineering C
  • Record number

    2103905