Title of article :
Interfacial reactions between Ti thin films and InP
Author/Authors :
Wang، نويسنده , , D. G. Ivey، نويسنده , , D.G.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1996
Abstract :
Interfacial reactions that occur between Ti thin films and InP substrates during annealing from 250 to 550 °C have been studied. Initial interaction was detected at 325 °C, which resulted in the formation of metallic In and TiP. TiP formation was limited by kinetics at low temperatures and much of the P released during InP decomposition was lost to the atmosphere. The amount of TiP increased with increasing temperatures and TiP was the only Ti-P phase detected. No In-Ti compound formation was detected in any samples studied.
Keywords :
InP , Multicomponent metallizations , Ti thin films
Journal title :
MATERIALS SCIENCE & ENGINEERING: B
Journal title :
MATERIALS SCIENCE & ENGINEERING: B