Title of article :
Effect of Ti additions on the electrical resistivity of copper
Author/Authors :
Nagarjuna، نويسنده , , S. P. Balasubramanian، نويسنده , , Anu K. and Sarma، نويسنده , , D.S.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1997
Abstract :
Electrical resistivity of CuTi alloys containing 1.5, 2.7, 4.5 and 5.4 wt.% Ti, has been determined from the resistance values measured using Kelvins Bridge apparatus at room temperature. The resistivity in solution-treated alloys increases with Ti content linearly up to about 4.0 wt.% Ti, beyond which it decreases with further additions of Ti. However, in peak-aged condition, the resistivity continues to increase linearly up to 5.4 wt.% Ti without showing any decrease. Nordheimʹs rule of resistivity is followed up to approximately 4.0 wt.% Ti in the solution-treated alloys. Further, Nordheimʹs rule modified with the incorporation of the law of mixtures for two-phase systems (ρt = ρmνfm + ρpνfp) is obeyed right up to 5.4 wt.% Ti in the peak-aged alloys. The difference in behaviour is attributed to the fine scale precipitation formed during quenching in solution-treated Cu—4.5Ti and Cu—5.4Ti alloys, as revealed by transmission electron microscopy (TEM). The contribution to the total resistivity by β′-Cu4Ti precipitate and prior cold deformation is considerable in deformed and peak-aged CuTi alloys.
Keywords :
Copper—titanium alloys , Electrical resistivity , Transmission electron microscopy
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Journal title :
MATERIALS SCIENCE & ENGINEERING: A