Title of article :
Fatigue crack nucleation assisted by thermal activation
Author/Authors :
Fine، نويسنده , , M.E and Stolkarts، نويسنده , , V and Keer، نويسنده , , L.M، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Pages :
5
From page :
5
To page :
9
Abstract :
Experimental evidence is presented that very early in the fatigue lifetime of Sn–Pb eutectic solder the fatigue damage is governed by microcrack nucleation. A model for thermally assisted fatigue crack initiation is presented using standard equations for nucleation in phase transformations. Predictions of the model are in good agreement with nucleation data for this solder.
Keywords :
Nucleation , Fatigue , thermal , Crack , activation , Solder
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
1999
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2135686
Link To Document :
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