Title of article
Fatigue crack nucleation assisted by thermal activation
Author/Authors
Fine، نويسنده , , M.E and Stolkarts، نويسنده , , V and Keer، نويسنده , , L.M، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
5
From page
5
To page
9
Abstract
Experimental evidence is presented that very early in the fatigue lifetime of Sn–Pb eutectic solder the fatigue damage is governed by microcrack nucleation. A model for thermally assisted fatigue crack initiation is presented using standard equations for nucleation in phase transformations. Predictions of the model are in good agreement with nucleation data for this solder.
Keywords
Nucleation , Fatigue , thermal , Crack , activation , Solder
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
1999
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2135686
Link To Document