Role of soldering parameters on the electrical performances presented by Cu–Sn–Cu joints used in power diodes

Results are presented on the electrical characteristics of power diodes soldered using new lead-free techniques based on Cu–Sn–Cu joints. Special emphasis is put on the role of the thickness of the Cu films electrodeposited on the electrical performances of the power diodes joined and to study the electrical stability of the joints formed, under extreme aggressive conditions.