Title of article
Phase-field modeling of rapid solidification
Author/Authors
Kim، نويسنده , , Seong Gyoon and Tae Kim، نويسنده , , Won، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2001
Pages
6
From page
281
To page
286
Abstract
Rapid directional solidification under a constant thermal gradient was simulated by a new phase-field model. The banded structures in an Al–Cu alloy were successfully reproduced. Only a few cells or dendrites survive in every transition steps into the plane-front mode, which explains the large grain size of banded structure observed in experiments. The noise level in concentration plays a crucial role in the transition procedure of the cell/dendrite into the plane-front mode and so in the overall pattern formation of the banded structure.
Keywords
Rapid solidification , phase-field model , Banded structure
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2001
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2136720
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