Title of article :
Structure properties of CuNi alloys at the rapid cooling rate using embedded-atom method
Author/Authors :
Cong، نويسنده , , Hong-Ri and Bian، نويسنده , , Xiufang and Zhang، نويسنده , , Jingxiang and Li، نويسنده , , Hui، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2002
Pages :
5
From page :
343
To page :
347
Abstract :
The structure evolution in CuNi alloys with different contents of Cu and Ni is studied at the cooling rate of 4×1014 K s−1 by means of the embedded-atom method based on molecular dynamics simulation. Techniques such as pair correction function, pair analysis technique, bond orientation order and diffusion coefficient are used to reveal the structural features of CuNi alloy in the process of the rapid solidification from 1573 to 300 K. It is found that there exists the chemical short-range order and topology short-range order in CuNi alloy. The simulation also shows that CuNi alloys, other than Cu20Ni80, form the amorphous structure while Cu20Ni80 alloy forms h.c.p. crystalline structure at the above cooling rate.
Keywords :
Molecular dynamics , EAM potential , Rapid solidification
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2002
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2137446
Link To Document :
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