Effect of Cu surface segregation on properties of NiFe/FeMn bilayers

The films of NiFe/FeMn with Ta and Ta/Cu buffer layers were prepared by magnetron sputtering. Results show that the exchange bias field of NiFe/FeMn films with Ta/Cu buffer is lower than that of the films with Ta buffer. The crystalline texture, surface roughness and element distribution of these two sets of samples were examined, and there is no apparent difference for the texture and roughness. However, the segregation of Cu atoms on the surface of NiFe in the trilayer of Ta/Cu/NiFe has been observed by using the angle-resolved X-ray photoelectron spectroscopy. The decrease of the exchange bias field for NiFe/FeMn films with Ta/Cu buffer layers is mainly caused by the diffusion of Cu atoms through NiFe layer, which stayed at the interface of NiFe/FeMn film or even intruded into FeMn layer. The present results indicate that Cu segregation through NiFe layer should be suppressed in order to improve the exchange bias field in giant magnetoresistance spin valves with Cu spacer.