Title of article
Contribution for the optimization of the vapor phase decomposition technique
Author/Authors
Danel، نويسنده , , A. and Lardin، نويسنده , , T. and Giroud، نويسنده , , C. and Tardif، نويسنده , , F.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2003
Pages
5
From page
213
To page
217
Abstract
This paper discusses the vapor phase decomposition (VPD) method used to collect metals from wafer surfaces prior to inductive coupled plasma mass spectrometry, atomic absorption spectrometry, or total X-rays fluorescence analysis. From a low limit of detection (LLD) point of view, the VPD protocol was analyzed to study the possible parasitic contamination introduced by each elementary step. The critical steps were identified and optimized in order to minimize detrimental impact on LLD. Finally, an order of magnitude improvement was gained by modifying the VPD reactor conditioning and using ultra high purity chemicals. The contamination recovery during the droplet collection step was studied for several metals as a function of the collection chemistry. It is shown that the kinetic plays a key role on the collection efficiency of metallic contamination.
Keywords
Metallic contamination , Vapour phase decomposition , Silicon wafer
Journal title
MATERIALS SCIENCE & ENGINEERING: B
Serial Year
2003
Journal title
MATERIALS SCIENCE & ENGINEERING: B
Record number
2139493
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