Title of article
Trends, demands and challenges in TCAD
Author/Authors
Bork، نويسنده , , Ingo and Moroz، نويسنده , , Victor and Bomholt، نويسنده , , Lars and Pramanik، نويسنده , , Dipu، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2005
Pages
5
From page
81
To page
85
Abstract
Currently, TCAD is most heavily used in the device research and process integration phases of a technology life cycle. However, a major trend visible in the industry is the demand to apply TCAD tools far beyond the integration phase into manufacturing and yield optimization. Short IC product lifetimes make fast yield ramp-up critical for being profitable and TCAD tools build a bridge between IC design and manufacturing. Another major trend is to use TCAD to evaluate layout dependent stress variations and account for these variations in the design flow of standard cells, libraries and custom ICs. This article gives an overview of those trends and addresses resulting challenges for TCAD models and tools.
Keywords
TCAD , Semiconductor technology , ACP
Journal title
MATERIALS SCIENCE & ENGINEERING: B
Serial Year
2005
Journal title
MATERIALS SCIENCE & ENGINEERING: B
Record number
2143194
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