Title of article :
Observation of twin boundary migration in copper during deformation
Author/Authors :
Field، نويسنده , , D.P. and True، نويسنده , , B.W. and Lillo، نويسنده , , T.M. and Flinn، نويسنده , , J.E.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2004
Pages :
7
From page :
173
To page :
179
Abstract :
A previous investigation produced evidence that twin boundaries in annealed copper were a significant source of dislocations during the initial stages of plastic flow. The character of the dislocation source was unknown, but it was hypothesized that twin boundaries could be non-regenerative dislocation sources that would cause migration of the boundary during plastic deformation. Channel die deformation and intermittent orientation imaging were performed on split specimens of pure copper in an attempt to observe twin boundary migration. Approximately 15% of the twin boundaries were observed to migrate beyond that expected from the imposed strain. The data support the hypothesis that twin boundaries can serve as dislocation sources.
Keywords :
Twin boundaries , Copper , electron backscatter diffraction (EBSD) , Deformation
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2004
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2143831
Link To Document :
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