Title of article :
High spatial resolution stress measurements using synchrotron based scanning X-ray microdiffraction with white or monochromatic beam
Author/Authors :
Tamura، نويسنده , , N. and Padmore، نويسنده , , H.A. and Patel، نويسنده , , J.R.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2005
Pages :
7
From page :
92
To page :
98
Abstract :
Scanning X-ray microdiffraction (μSXRD) combines the use of high brilliance synchrotron sources with state-of-the-art achromatic X-ray focusing optics and large area detector technology. Using either white or monochromatic beams, it allows for orientation and strain/stress mapping of polycrystalline thin films with submicron spatial resolution. The present paper will focus on three applications performed at the Advanced Light Source: the study of local plasticity in aluminum thin films, the study of the spontaneous growth of tin whiskers in lead-free solder finish and the measurement of strain field around thin film bucklings.
Keywords :
electronic packaging , Thin films , X-ray microdiffraction , stress measurements
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2005
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2146247
Link To Document :
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