Simulation analysis of thermal state of conducting elements with narrowings made by use of laser micromachining

Localized laser microtechnologies like microremelting, microalloying or material removal allow manufacturing of submilimeter scale elements with accuracy sufficient for applications in electronics and electrical engineering. In this respect, traditional mechanical cutting of miniature fuse links did not give satisfactory results. Here we present our new, laser-based approach to creation of conductive elements for new generation of fuses. This paper contains our results of manufacturing process and computer model-based simulations of thermal state of obtained fuse links. In particular the proper power densities for laser microcutting of holes in fuse links with Nd:YAG laser (355 nm) and fiber laser (1070 nm) were determined. Simulation analysis combined with experiments allowed estimation of the best values of laser process parameters for producing fuse links with good functional properties. Simulation of the thermal state of fuses (made in optimal conditions) has indicated their disintegration due to predicted short circuit current.