Author/Authors :
Liu، نويسنده , , Tao and Zhang، نويسنده , , Huayan and Wang، نويسنده , , Fei and Shi، نويسنده , , Jing and Ci، نويسنده , , Pengliang and Wang، نويسنده , , Lianwei and Ge، نويسنده , , Shuli and Wang، نويسنده , , Qingjiang and Chu، نويسنده , , Paul K.، نويسنده ,
Abstract :
Three-dimensional (3D) supercapacitors consisting of Ba0.65Sr0.35TiO3 (BST)/NiSi2/silicon microchannel plate (MCP) stacked structure have been fabricated. The silicon MCP produced by electrochemical etching is utilized as a backbone of the 3D structure on which a nickel silicide current collector layer and Ba0.65Sr0.35TiO3 dielectric layer are deposited successively by electroless plating and the sol–gel method, respectively. The morphology and structure of the 3D BST/NiSi2/Si-MCP structure are characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD) and the electrochemical properties are determined by cyclic voltammetry (CV) and chronopotentiometry. The structure exhibits excellent capacitive behavior with a maximum capacitance of 784 F g−1. After 700 charging/discharging cycles, the Cf decreases slightly with only a 5.7% loss and is stable after more than 700 cycles. The BST/NiSi2/Si-MCP 3D structure is a potential supercapacitor in industrial applications.
