• Title of article

    A probabilistic model for prediction of bonding time in diffusion bonding

  • Author/Authors

    Li، نويسنده , , Shu-Xin and Tu، نويسنده , , Shan-Tung and Xuan، نويسنده , , Fu-Zhen، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2005
  • Pages
    6
  • From page
    250
  • To page
    255
  • Abstract
    A probabilistic model for prediction of bonding time in diffusion bonding is presented based on the stochastic characteristics of surface finish of bonded area. The probabilistic distribution of surface roughness is introduced into a deterministic model of diffusion bonding by taking the parameters of void radius and height as random variables. Monte Carlo simulation technique in conjunction with numerical integration is used to calculate the bonding time and its probabilistic distribution. The sensitivity analysis of parameters is then performed to evaluate the effects of creep exponent and surface roughness on the bonding time. Comparison is also made between the theoretical predictions and available experimental results from previous work on Ti–6Al–4V alloy in order to validate the probabilistic model. The proposed model showed a good agreement with the experimental results.
  • Keywords
    Bonding time , Void radius , Probabilistic model , Surface roughness
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2005
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2148907