Title of article :
A probabilistic model for prediction of bonding time in diffusion bonding
Author/Authors :
Li، نويسنده , , Shu-Xin and Tu، نويسنده , , Shan-Tung and Xuan، نويسنده , , Fu-Zhen، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2005
Pages :
6
From page :
250
To page :
255
Abstract :
A probabilistic model for prediction of bonding time in diffusion bonding is presented based on the stochastic characteristics of surface finish of bonded area. The probabilistic distribution of surface roughness is introduced into a deterministic model of diffusion bonding by taking the parameters of void radius and height as random variables. Monte Carlo simulation technique in conjunction with numerical integration is used to calculate the bonding time and its probabilistic distribution. The sensitivity analysis of parameters is then performed to evaluate the effects of creep exponent and surface roughness on the bonding time. Comparison is also made between the theoretical predictions and available experimental results from previous work on Ti–6Al–4V alloy in order to validate the probabilistic model. The proposed model showed a good agreement with the experimental results.
Keywords :
Bonding time , Void radius , Probabilistic model , Surface roughness
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2005
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2148907
Link To Document :
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