Title of article
Influence of Ti on wetting of AlN by Ni-base alloys
Author/Authors
Koltsov، نويسنده , , Alexey and Dumont، نويسنده , , Mikael and Hodaj، نويسنده , , Fiqiri and Eustathopoulos، نويسنده , , Nicolas، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2006
Pages
6
From page
171
To page
176
Abstract
Pure Ni at its melting point does not wet AlN, the contact angle being higher than 90°. The aim of this study is to define Ni-based alloys leading to low wetting contact angles, fast spreading and low reactivity. In order to achieve these purposes, two alloying elements are used. The first is Ti, which is expected to improve wetting by forming wettable titanium nitride at the Ni alloy/AlN interface. The second is Si, which is added in order to decrease the reactivity by lowering the alloy melting point.
ments are performed in high vacuum by the sessile drop technique. The morphology and chemistry of interfacial reaction products are characterised by SEM and X-ray microanalysis. The results of wetting kinetics are analysed using the recently developed reactive spreading model.
Keywords
spreading , Adhesion , Interfaces , Reactivity , nitrides
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2006
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2149199
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