Title of article :
Joint structure in high brightness light emitting diode (HB LED) packages
Author/Authors :
Park، نويسنده , , Jin Woo and Yoon، نويسنده , , Young-Bok and Shin، نويسنده , , Sang-Hyun and Choi، نويسنده , , Sang-Hyun، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2006
Abstract :
We present the transmission electron microscopy (TEM) analysis of 1.5 μm-thick Au–20Sn solder joint between a high brightness light emitting diode (HB LED) and a Si heat sink. Due to intermetallic compound formation, global Sn depletion occurred in the thin solder, which raised the melting point of the solder and caused local incompleteness of bonding.
Keywords :
HB LED , Thermal Resistance , Package , Au–Sn
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
