Title of article
Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement
Author/Authors
Ji، نويسنده , , Young-Su and Chung، نويسنده , , Sung Jae and Ok، نويسنده , , Myoung-Ryul and Hong، نويسنده , , Kyung Tae and Suh، نويسنده , , Jin-Yoo and Byeon، نويسنده , , Jai Won and Yoon، نويسنده , , Jin-Kook and Lee، نويسنده , , Kyung-Hwan and Lee، نويسنده , , Kyung Sub، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
5
From page
521
To page
525
Abstract
The crystallization behavior of Cu43Zr43Al7Ag7 (numbers indicate at.%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 °C in the supercooled liquid region. The crystallization process is a single step phase transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate.
Keywords
Annealing , metallic glass , Electrical resistivity , crystallization
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2007
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2151404
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