Title of article :
Dynamic simulation of solid-state diffusion bonding
Author/Authors :
Wu، نويسنده , , G.Q. and Li، نويسنده , , Z.F. and Luo، نويسنده , , G.X. and Li، نويسنده , , H.Y. and Huang، نويسنده , , Z.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Pages :
7
From page :
529
To page :
535
Abstract :
By using the real information of the intended bonding surface and considering the effect of the diffusion distance in a definite time, a new theoretical model for diffusion bonding was proposed. The effects of different operating mechanisms, bonding parameters and microstructures on bonding were investigated. The simulation results indicate that, it is vital to consider the real information of the intended bonding surfaces and the effect of diffusion distance in a definite time; the metastable microstructure and the stable ultrafine microstructure exhibit better bonding characteristic than that of the original stable microstructure, which is in agreement with experimental results.
Keywords :
MODELING , diffusion , surface , Diffusion bonding , microstructure
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2007
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2151651
Link To Document :
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