Title of article :
The interfacial reaction between Sn–Ag alloys and Co substrate
Author/Authors :
Zhu، نويسنده , , WenJun and Wang، نويسنده , , Jiang and Liu، نويسنده , , Huashan and Jin، نويسنده , , ZhanPeng and Gong، نويسنده , , WeiPing، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2007
Pages :
5
From page :
109
To page :
113
Abstract :
Interfacial reactions between Sn or Sn–3.5 wt.%Ag and Co substrate at 573 K for different durations were studied. Only one intermetallic compound (IMC), CoSn3, was detected as a product of interfacial reaction, although there are several other IMCs in the Co–Sn binary system. This observation has been discussed from both the driving force for nucleation of the IMCs and diffusion of Co across the interface. Change of the thickness of CoSn3 layer with annealing time obeys a parabolic rule with time exponent of about 0.5, implying a diffusion-controlled mechanism. In addition, addition of Ag into Sn decreases the growth rate of the CoSn3 layer.
Keywords :
Sn–Ag alloy , Co substrate , Interfacial reaction , diffusion
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2007
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2152199
Link To Document :
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