Title of article
Kirkendall porosity during thermal treatment of Mo–Cu nanomultilayers
Author/Authors
Srinivasan، نويسنده , , Dheepa and Subramanian، نويسنده , , P.R.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
6
From page
145
To page
150
Abstract
Mo–Cu nanomultilayers were investigated as part of an effort to understand mechanisms of thermal stability in layered nanostructures. The multilayers were fabricated by magnetron sputtering with a range of layer spacings. Thermal treatment of the Mo–Cu nanomultilayers showed the formation of nanovoids along Cu–Mo layer interfaces and Mo–Mo grain boundaries. The size of the void was concurrent with the size of Cu. This was attributed to a Kirkendall type of effect caused by vacancy diffusion in metallic nanoscaled multilayered films.
Keywords
Thermal grooving , Vacancy diffusion , Cu–Mo , Kirkendall porosity , Nanomultilayers
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2007
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2152476
Link To Document