Title of article :
The role of strain rate during deposition of CAP on Ti6Al4V by superplastic deformation-like method using high-temperature compression test machine
Author/Authors :
Ramdan، نويسنده , , R.D. and Jauhari، نويسنده , , I. and Hasan، نويسنده , , R. and Masdek، نويسنده , , N.R. Nik، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2008
Pages :
6
From page :
300
To page :
305
Abstract :
This paper describes an implementation of superplastic deformation method for the deposition of carbonated-apatite (CAP) on the well-know titanium alloy, Ti6Al4V. This deposition process was carried out using high-temperature compression test machine, at temperature of 775 °C, different strain rates, and conducted along the elastic region of the sample. Before the process, titanium substrate was cryogenically treated in order to approach superplastic characteristic during the process. After the process, thin film of CAP was created on the substrate with the thickness from 0.71 μm to 1.42 μm. The resulted film has a high density of CAP that covered completely the surface of the substrate. From the stress–strain relation chart, it can be observed that as the strain rate decreases, the area under stress–strain chart also decreases. This condition influences the density of CAP layer on the substrate that as this area decreases, the density of CAP layer also decreases as also confirmed by X-ray diffraction characterization. In addition, since the resulting layer of CAP is in the form of thin film, this layer did not alter the hardness of the substrate as measured by Vickers hardness test method. On the other hand, the resulting films also show a good bonding strength properties as the layer remain exist after friction test against polishing clothes for 1 h.
Keywords :
Carbonated-apatite , Superplastic Deformation , Titanium alloy , Deposition process , Strain rate
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2008
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2153762
Link To Document :
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