Title of article
Detection of subsurface voids using scanning thermal microscopy
Author/Authors
Mills، نويسنده , , G and Weaver، نويسنده , , J.M.R and Harris، نويسنده , , G and Chen، نويسنده , , Russell and Enriquez-Carrejo، نويسنده , , J and Johnson، نويسنده , , L and Rogers، نويسنده , , B، نويسنده ,
Issue Information
دوماهنامه با شماره پیاپی سال 1999
Pages
5
From page
7
To page
11
Abstract
A commercially available thermal scanned probe microscope has been used to look at voids which are buried under a SiO2 passivation layer. The microscope detects heat flow from the probe into the specimen. Results show that it is possible to detect thermal conductivity changes caused by subsurface voids at a depth of over 200 nm.
Journal title
Ultramicroscopy
Serial Year
1999
Journal title
Ultramicroscopy
Record number
2155285
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