Author/Authors :
Mills، نويسنده , , G and Weaver، نويسنده , , J.M.R and Harris، نويسنده , , G and Chen، نويسنده , , Russell and Enriquez-Carrejo، نويسنده , , J and Johnson، نويسنده , , L and Rogers، نويسنده , , B، نويسنده ,
Abstract :
A commercially available thermal scanned probe microscope has been used to look at voids which are buried under a SiO2 passivation layer. The microscope detects heat flow from the probe into the specimen. Results show that it is possible to detect thermal conductivity changes caused by subsurface voids at a depth of over 200 nm.
