Title of article :
Deformation behavior and microstructure evolution of 7050 aluminum alloy during high temperature deformation
Author/Authors :
Hu، نويسنده , , H.E. and Zhen، نويسنده , , L. and Yang، نويسنده , , L. and Shao، نويسنده , , W.Z. and Zhang، نويسنده , , B.Y.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2008
Abstract :
Deformation behavior and microstructure evolution of 7050 aluminum alloy were investigated by tensile tests conducted at different temperatures (340, 380, 420, and 460 °C) with different strain rates of 1.0 × 10−4, 1.0 × 10−3, 1.0 × 10−2 and 0.1 s−1. The results show that the stress level of the alloy can be presented by a Zener–Holloman parameter in a hyperbolic sine-type equation with the hot activation energy of 256.6 kJ/mol. Ductile transgranular fracture transforms progressively into ductile intergranular (or inter-subgranular) fracture with the decrease of Z value. At the same time, the soften mechanism of the alloy during high temperature deformation transforms from dynamic recovery to continuous dynamic recrystallization with decreasing Z value. The main deformation mechanism is usual slipping when the alloy was deformed at high Z value. Grain boundaries sliding takes part in deformation with low Z value. Grain boundaries migration plays the role with medium Z value.
Keywords :
microstructure , EBSD , aluminum alloy , High temperature deformation
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Journal title :
MATERIALS SCIENCE & ENGINEERING: A