Relative slipping of interface of titanium alloy to stainless steel during vacuum hot roll bonding

The strain–time relation during vacuum hot roll bonding of titanium alloy to stainless steel was simulated by the finite element method software MSC Marc. The characters of the strain variation with time of nodes in the section of Ti, Cu and steel were contrasted between the two conditions of using no interlayer and using copper interlayer. The results show that the relative motion between two contacting surfaces using no interlayer is much smaller than that using copper interlayer. The plastic deformation of stainless-steel plate is larger than that of titanium alloy plate at 780 °C and smaller at 880 °C. The relative slipping between different plates is increased by using copper interlayer. It can break the oxide film to reveal the fresh surfaces and promote contacting between interfaces to be bonded. This lay a foundation on the reasonable choose of deformation during vacuum hot roll bonding of titanium alloy to stainless steel.