Title of article :
Computation method of metalʹs flow stress for electroplastic effect
Author/Authors :
Li، نويسنده , , Dalong and Yu، نويسنده , , Enlin، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2009
Pages :
3
From page :
62
To page :
64
Abstract :
Based on the thermally activated plastic flow concept, a method is presented for calculating the amount of metalʹs flow stress for electroplastic effect. This calculation method takes into account both the influence of internal local stress field on dislocation slipping velocity and the change of the parameters of the thermally activated rate equation with a current pulse applied. The results not only indicate that the relational expression of the metalʹs flow stress and current density but also demonstrate the metalʹs flow stress drop associates with an enhanced plastic strain rate. Moreover, the experimental research on tensile tests of copper wire was carried out. The experimental results show that the computational values are reliable while the current density is lower than 1500 A/mm2.
Keywords :
electroplastic effect , Flow stress , Dislocation , Thermal activation
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2009
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2159335
Link To Document :
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