• Title of article

    Atomic simulation of grain boundary sliding in Co/Cu two-phase bicrystals

  • Author/Authors

    Yuasa، نويسنده , , Motohiro and Nakazawa، نويسنده , , Takumi and Mabuchi، نويسنده , , Mamoru، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2010
  • Pages
    8
  • From page
    2629
  • To page
    2636
  • Abstract
    Molecular dynamic simulations of grain boundary sliding were performed on Cu/Cu one-phase bicrystal and Co/Cu two-phase bicrystal models. The grain boundary sliding and migration behaviors of the Co/Cu bicrystals were different from those of the Cu/Cu bicrystals, and the Co/Cu sliding behavior was less related to the free volume, than that of Cu/Cu. In the Co/Cu(2 2 1) grain boundary model, the pore structure units were formed on the Cu side very near the Co/Cu interface, not just at the interface. The onset of grain boundary sliding in the Co/Cu bicrystals was due to the uncorrelated atomic shuffling induced by the pore structure units.
  • Keywords
    Copper , Molecular dynamics , Grain boundary structure , grain boundary sliding
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2010
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2162086