• Title of article

    On the Hall–Petch relationship in a nanostructured Al–Cu alloy

  • Author/Authors

    Shanmugasundaram، نويسنده , , T. and Heilmaier، نويسنده , , M. and Murty، نويسنده , , B.S. and Sarma، نويسنده , , V. Subramanya، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2010
  • Pages
    5
  • From page
    7821
  • To page
    7825
  • Abstract
    Mechanical properties of bulk nanocrystalline Al–4Cu alloys with grain sizes from 47 to 105 nm, synthesized by mechanically alloying followed by vacuum hot pressing at different temperatures, were analysed through Hall–Petch relation. Hall–Petch analysis revealed a high frictional stress (170 MPa) and a high positive slope ( 0.13   MPa   m ) as compared to pure Al, which has a frictional stress (15–30 MPa) and a slope ( 0.06 – 0.09   MPa   m ). From a detailed evaluation of different strengthening mechanisms it is inferred that the Al2Cu precipitates and oxide particles are the likely reason for such high values of frictional stress and slope.
  • Keywords
    nanostructured materials , mechanical alloying , Aluminum alloys , Hall–Petch relation , HOT PRESSING
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2010
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2163509