Title of article
On the Hall–Petch relationship in a nanostructured Al–Cu alloy
Author/Authors
Shanmugasundaram، نويسنده , , T. and Heilmaier، نويسنده , , M. and Murty، نويسنده , , B.S. and Sarma، نويسنده , , V. Subramanya، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2010
Pages
5
From page
7821
To page
7825
Abstract
Mechanical properties of bulk nanocrystalline Al–4Cu alloys with grain sizes from 47 to 105 nm, synthesized by mechanically alloying followed by vacuum hot pressing at different temperatures, were analysed through Hall–Petch relation. Hall–Petch analysis revealed a high frictional stress (170 MPa) and a high positive slope ( 0.13 MPa m ) as compared to pure Al, which has a frictional stress (15–30 MPa) and a slope ( 0.06 – 0.09 MPa m ). From a detailed evaluation of different strengthening mechanisms it is inferred that the Al2Cu precipitates and oxide particles are the likely reason for such high values of frictional stress and slope.
Keywords
nanostructured materials , mechanical alloying , Aluminum alloys , Hall–Petch relation , HOT PRESSING
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2010
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2163509
Link To Document