Title of article :
Mechanism of creep deformation of Alloy 230 based on microstructural analyses
Author/Authors :
Chatterjee، نويسنده , , Sudin and Roy، نويسنده , , Ajit K.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2010
Pages :
8
From page :
7893
To page :
7900
Abstract :
Creep testing of Alloy 230 was performed at 750, 850 and 950 °C under applied stresses equivalent to its 10% and 25% yield strength (YS) values. The results indicate that this alloy satisfied the maximum allowable creep strain of 1% when loaded to 0.10YS level at these temperatures. Microscopic evaluations revealed the formation of second phase particles including superstructures and carbide precipitates as a function of temperature. The enhanced plastic strain at 0.25YS stress level at 950 °C was attributed to dislocation glide, subgrain formation, and recrystallization.
Keywords :
Alloy 230 , Temperature and stress effect , Microscopy , Creep mechanism
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2010
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2163540
Link To Document :
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