Title of article
Microstructure; bonding strength and thickness ratio of Al/Mg/Al alloy laminated composites prepared by hot rolling
Author/Authors
Zhang، نويسنده , , X.P. and Yang، نويسنده , , T.H. and Castagne، نويسنده , , S. and Wang، نويسنده , , J.T.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2011
Pages
7
From page
1954
To page
1960
Abstract
In this study, 7075 Al/AZ31B Mg/7075 Al laminated composites were prepared by hot roll bonding method. Microstructure and bonding strength of the experimental laminated composites, and thickness ratio of the constituent layers after hot rolling were evaluated. Effects of reduction ratio and rolling temperature on the microstructure, bonding strength and thickness ratio were also studied. Dynamic recrystallization microstructures were observed in the composite. The bonding strength decreased with reduction ratio and rolling temperature due to the increase in the grain size and diffusion layer width with the reduction ratio and rolling temperature. The maximal bonding strength of the experimental laminated composite was 66 MPa. The thickness fraction of the Mg alloy plate after hot rolling decreased with the reduction ratio and rolling temperature.
Keywords
Hot Rolling , Reduction ratio , Bonding strength , Thickness ratio , microstructure
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2011
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2163594
Link To Document