• Title of article

    Microstructure; bonding strength and thickness ratio of Al/Mg/Al alloy laminated composites prepared by hot rolling

  • Author/Authors

    Zhang، نويسنده , , X.P. and Yang، نويسنده , , T.H. and Castagne، نويسنده , , S. and Wang، نويسنده , , J.T.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2011
  • Pages
    7
  • From page
    1954
  • To page
    1960
  • Abstract
    In this study, 7075 Al/AZ31B Mg/7075 Al laminated composites were prepared by hot roll bonding method. Microstructure and bonding strength of the experimental laminated composites, and thickness ratio of the constituent layers after hot rolling were evaluated. Effects of reduction ratio and rolling temperature on the microstructure, bonding strength and thickness ratio were also studied. Dynamic recrystallization microstructures were observed in the composite. The bonding strength decreased with reduction ratio and rolling temperature due to the increase in the grain size and diffusion layer width with the reduction ratio and rolling temperature. The maximal bonding strength of the experimental laminated composite was 66 MPa. The thickness fraction of the Mg alloy plate after hot rolling decreased with the reduction ratio and rolling temperature.
  • Keywords
    Hot Rolling , Reduction ratio , Bonding strength , Thickness ratio , microstructure
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2011
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2163594