Title of article
Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires
Author/Authors
Hug، نويسنده , , E. and Bellido، نويسنده , , N.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2011
Pages
4
From page
7103
To page
7106
Abstract
Heat treatments performed on copper-clad aluminium thin wires increase the ductility of copper and aluminium but activate diffusion between both layers, creating brittle intermetallic compounds. Ductility reaches a maximum for an optimal intermetallic thickness related to appropriate annealing conditions in order to avoid Kirkendall void formation assisted by stress gradients.
Keywords
Copper-clad aluminium , Deformation and fracture , Annealing processes , mechanical properties , diffusion , Drawing , Intermetallic alloys and compounds
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2011
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2164714
Link To Document