Title of article :
Hot deformation behavior of Cu–8.0Ni–1.8Si–0.15Mg alloy
Author/Authors :
Zhang، نويسنده , , L. and Li، نويسنده , , Z. and Lei، نويسنده , , Q. and Qiu، نويسنده , , W.T. and Luo، نويسنده , , H.T.، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2011
Pages :
7
From page :
1641
To page :
1647
Abstract :
The hot deformation of Cu–8.0Ni–1.8Si–0.15Mg (wt.%) alloy sample was carried out on a Gleeble-1500 thermo-simulator with various strain rates at different deformation temperatures. The thermal deformation activation energy Q was calculated and hot compression constitutive equation has been established. Metallomicroscopy was employed to analyze the microstructures evolution of the alloy during deformation. The working hardening, the dynamic recovery and the dynamic recrystallization play important roles to affect the plastic deformation behaviors of the alloy at different temperature regions. The processing map of the alloy has been established.
Keywords :
Deformation , Cu–Ni–Si alloy , Stress–strain , Recrystallization
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Serial Year :
2011
Journal title :
MATERIALS SCIENCE & ENGINEERING: A
Record number :
2167272
Link To Document :
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