Title of article
Shear banding deformation in Cu/Ta nano-multilayers
Author/Authors
Wang، نويسنده , , F. and Huang، نويسنده , , P. and Xu، نويسنده , , M. and Lu، نويسنده , , T.J. and Xu، نويسنده , , K.W.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2011
Pages
5
From page
7290
To page
7294
Abstract
Nanoscale Cu/Ta multilayers with individual layer thickness ranging from 3 to 70 nm were deformed under nanoindentation at room temperature. Shear bands can be observed only when individual layer thickness is reduced to 9 nm or below, indicating formation of shear bands in the Cu/Ta multilayers is layer thickness dependent. By observing the cross sectional transmission electron microscope images of the indentation fabricated through focused ion beam technique, shear banding deformation causing a unique layer-morphology with prevalent mismatched laminate structure has been reported for the first time. By capturing and analyzing a series of typical indentation-induced deformed microstructures, a new physical mechanism of shear banding behavior in metallic nano-multilayers is suggested.
Keywords
Shear band , Nanoindentation , Grain boundaries , Multilayer structure
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2011
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2168643
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