• Title of article

    High-temperature creep behavior of Al–Cu–Mg alloy

  • Author/Authors

    Lin، نويسنده , , William Y.C. and Xia، نويسنده , , Yu-Chi and Ma، نويسنده , , Xue-Song and Jiang، نويسنده , , Yuqiang and Chen، نويسنده , , Ming-Song، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2012
  • Pages
    6
  • From page
    125
  • To page
    130
  • Abstract
    The high-temperature creep behavior of Al–Cu–Mg alloy was studied by the constant-stress uniaxial tensile creep experiments under the temperatures of 473 K, 503 K and 533 K. Constitutive models for describing the high-temperature creep behavior of Al–Cu–Mg were established based on the θ projection method. The material parameters of the established constitutive models are associated with applied creep stress and temperature. Results show that a good agreement between the experimental and predicted results is obtained, which confirms that the established creep constitutive models can give an accurate and precise estimate of the high-temperature creep behavior for the studied Al–Cu–Mg alloy. Additionally, the specimens at 533 K failed by the intergranular creep fracture.
  • Keywords
    Aluminum alloys , thermomechanical processing , fracture , Bulk defromation
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2012
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2170908