• Title of article

    The role of Ag precipitates in Cu–12 wt% Ag

  • Author/Authors

    Yao، نويسنده , , D.W. and Song، نويسنده , , L.N. and Dong، نويسنده , , A.P. and Wang، نويسنده , , L.T. and Zhang، نويسنده , , L. and Meng، نويسنده , , L.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2012
  • Pages
    4
  • From page
    607
  • To page
    610
  • Abstract
    The Cu–12 wt% Ag was prepared to investigate the role of Ag precipitates on the properties of the alloy. Two kinds of heat treatment procedures were adopted to produce different amount of Ag precipitates in the Cu–12 wt% Ag. The microstructure of Ag precipitates was systematically observed by optical microscopy and electron microscopy. The Cu–12 wt% Ag with more Ag precipitates exhibits higher strength and lower electrical conductivity. More Ag precipitates results in more phase interface and less Ag atoms dissolved in Cu matrix. By comparing the strengthening effect and electron scattering effect of phase interface and dissolved Ag atoms, it is conclude that the interface between Cu matrix and Ag precipitates could significantly block dislocation movement and enhance electron scattering in Cu–Ag alloys.
  • Keywords
    Strength , Copper alloys , electrical conductivity , Interface , Electron microscopy
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Serial Year
    2012
  • Journal title
    MATERIALS SCIENCE & ENGINEERING: A
  • Record number

    2171745