Title of article
The role of Ag precipitates in Cu–12 wt% Ag
Author/Authors
Yao، نويسنده , , D.W. and Song، نويسنده , , L.N. and Dong، نويسنده , , A.P. and Wang، نويسنده , , L.T. and Zhang، نويسنده , , L. and Meng، نويسنده , , L.، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2012
Pages
4
From page
607
To page
610
Abstract
The Cu–12 wt% Ag was prepared to investigate the role of Ag precipitates on the properties of the alloy. Two kinds of heat treatment procedures were adopted to produce different amount of Ag precipitates in the Cu–12 wt% Ag. The microstructure of Ag precipitates was systematically observed by optical microscopy and electron microscopy. The Cu–12 wt% Ag with more Ag precipitates exhibits higher strength and lower electrical conductivity. More Ag precipitates results in more phase interface and less Ag atoms dissolved in Cu matrix. By comparing the strengthening effect and electron scattering effect of phase interface and dissolved Ag atoms, it is conclude that the interface between Cu matrix and Ag precipitates could significantly block dislocation movement and enhance electron scattering in Cu–Ag alloys.
Keywords
Strength , Copper alloys , electrical conductivity , Interface , Electron microscopy
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Serial Year
2012
Journal title
MATERIALS SCIENCE & ENGINEERING: A
Record number
2171745
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