Effect of stacking fault energy on nanostructure formation under accumulative roll bonding (ARB) process

In this study, the effect of stacking fault energy on the formation of nanostructure in aluminum, copper, and brass fabricated via the accumulative roll bonding (ARB) process was investigated. Evolution of microstructure of the samples was investigated by transmission electron microscopy (TEM). Occurrence of the recrystallization (both continuous and discontinuous) in the copper and brass led to the formation of nano grains with mean sizes of 80, and 40 nm, respectively; while, the mean grain size of aluminum was 250 nm. Differences in microstructural evolution during processing of aluminum, copper, and brass was related to their stacking fault energies. In order to facilitate nanostructure formation in the commercial purity aluminum, the second phase particles (alumina) were added to aluminum matrix. In this case, the mean grain size of the aluminum changed down to 90 nm.