Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging

Uniaxial ratcheting behavior and the fatigue life of sintered nanosilver joint were investigated at room temperature. All tests were carried out under stress-controlled mode. Force–displacement data were recorded during the entire fatigue lifespan by a non-contact displacement detecting system. Effects of stress amplitude, mean stress, stress rate, and stress ratio on the uniaxial ratcheting behavior of the sintered nanosilver joint were discussed. Stress-life (S–N) curves of the sintered joints were also obtained. The Smith–Watson–Topper (SWT) model, the Gerber model and the modified Goodman model, all of which took effect of mean stress into consideration, were compared for predicting the fatigue life of the sintered joint. Both the ratcheting strain and its rate increased with increasing stress amplitude or mean stress. The increase in stress amplitude and mean stress both reduced the fatigue life of the sintered joint, while the fatigue life prolonged with the increase in stress rate and stress ratio. The modified Goodman model predicted the fatigue life of the sintered joints well.