• Title of article

    Multi-electrode CZT detector packaging using polymer flip chip bonding

  • Author/Authors

    Jordanov، نويسنده , , Valentin T. and Macri، نويسنده , , John R. and Clayton، نويسنده , , James E. and Larson، نويسنده , , Kipp A.، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2001
  • Pages
    7
  • From page
    511
  • To page
    517
  • Abstract
    Polymer flip chip bonding has been used to package a multi-electrode CZT detector. During the packaging process the temperature of all components was kept less than 80°C. The size of the conductive epoxy eontacts is less than 120 μm in diameter. Thermal cycling, and random and structural vibration tests indicate reliable detector–substrate interconnection and rugged construction.
  • Keywords
    Epoxy bonding , CZT detectors , Flip-Chip bonding , Detector packaging
  • Journal title
    Nuclear Instruments and Methods in Physics Research Section A
  • Serial Year
    2001
  • Journal title
    Nuclear Instruments and Methods in Physics Research Section A
  • Record number

    2188990

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=2188990