Characterization of indium and solder bump bonding for pixel detectors

A review of different bump-bonding processes used for pixel detectors is given. A large-scale test on daisy-chained components from two vendors has been carried out at Fermilab to characterize the yield of these processes. The vendors are Advanced Interconnect Technology Ltd. (AIT) of Hong Kong and MCNC in North Carolina, USA. The results from this test are presented and technical challenges encountered are discussed.